| 摘要 |
PROBLEM TO BE SOLVED: To prevent dents resulting due to solidification, when a through-hole and a recessed place formed in a filled substrate is filled with resin paste. SOLUTION: Filling printing is carried out by charging a resin paste 11 in a through-hole and recessed part of the filled substrate 4 having a through via conductor 3 which penetrates the substrate between a top surface 1A and reverse surface, and has the through-hole 2 inside and blind via conductor 5 which are arranged on the top surface and have the recessed parts, island-shaped resin pastes 12 are printed and formed around the through-holes and recessed parts, and the resin paste parts 11 and 12 are solidified. |
