| 摘要 |
PROBLEM TO BE SOLVED: To transfer a board even when there is a hydrophobic region on the surface of a board. SOLUTION: An upper arm UA of a first intermediate carrying robot 181 holds a wafer W by sucking the bottom of the wafer W. A spin chuck 22 is so made as to be lifted up and down by a two-stage cylinder mechanism 70. Elongation of a rod 71a of the cylinder on the first stage brings the retention claw 25 of the spin chuck 22 and the wafer W sufficiently close to each other. Then, the suction of the wafer W on the upper arm UA is released. Next, a rod 72a of the cylinder 72 on the second stage is extended, and the transfer of the wafer W from upper arm UA to the spin chuck 25 is achieved. Hereby, by the hem of the bottom of the wafer W abutting on the retention claw 25 with the treatment liquid on the hydrophobic surface of the wafer, even if moment is given to the wafer after the release of suction, the attitude change of the wafer W is regulated. |
