| 摘要 |
PROBLEM TO BE SOLVED: To prevent developer from containing air bubbles and dripping off from a nozzle even if wafer is larger than 12 inches (30 cm) in diameter, when developing solution is sprayed on the wafer, thus improving product yield. SOLUTION: A developer discharge nozzle has a structure, where a large number of hollow fibers 6 each having a large number of fine holes on its outer surface, prescribed in length, and very fine in inner diameter are bound into a bundle providing a space between them, and the bundle is housed and fixed in a housing 8. A developer, fed from a developing solution supply source, is introduced into spaces which are demarcated inside the housing 8 and discharged out of the housing 8 passing through the hollow fibers 8 via the fine holes bored in their outer surfaces, where flows of developer are bound into a bundle and spread concentrically in a laminar flow from the center to the periphery of a wafer so as to be discharged through a single hollow nozzle, despite the developer being discharged out through a large number of hollow fibers. |
