| 摘要 |
PROBLEM TO BE SOLVED: To provide only an electronic part transportation mechanism as a transportation mechanism for mounting electronic components of various kinds in a narrow space by coating a flux to each lead while an electronic component is transported and bonding each solder ball to each lead with the flux as a bonding agent. SOLUTION: An electronic component transportation mechanism 33 is moved to carry an electronic component 101 to a flux supply plate 32, and its lead terminal 102 is made to contact a flux surface of high viscosity which is controlled for film-thickness in advance, with a suitable amount of flux coated evenly on the bottom surface of all leads 102. A solder ball supply device is used to array and supply a solder ball 104 at each position corresponding to each lead 102, the electronic component transportation mechanism 33 transports the electronic component 101, while picking it, to above the solder ball supply device, the electronic component 101 is lowered there, and the solder ball 104 arrayed and supplied to a lead pitch in advance is made to contact and bond to each lead with the flux coated.
|
