| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC chip and a semiconductor device reliabile in electrical connection even if they do not have reinforcing lands, and to provide a method for manufacturing the semiconductor device. SOLUTION: This semiconductor device includes an IC chip 20 and a printed circuit board 30 mounted with the IC chip 20. The chip 20 has solder lands 22 for electrodes, and the lands are arranged along a plurality of concentric circles which are mutually separated from each other, with a bump being provided on each of the solder lands. The board 30 has solder lands 28 at positions corresponding to the solder lands 22 of the chip 20. Thereby even if the board 30 and chip 20 have different thermal expansion coefficients, stresses on junction parts (solders) between the board 30 and chip 20 can be dispersed to all the junction parts, thus making it difficult for the junction parts to be broken. |
