| 摘要 |
PROBLEM TO BE SOLVED: To raise reliability in printing with a solder paste by printing a flux or solder paste of high adhesion using a printing mask, and then doing a solder paste of low viscosity using the printing mask. SOLUTION: A printing mask is made to contact on a substrate 20 comprising a semiconductor wafer, a solder paste 40 of high viscosity and adhesion is supplied on the upper surface of the printing mask, and a squeegee 25 is moved to roll a solder paste 40, so that a through hole of the printing mask is filled with the solder paste 40. Then the substrate 20 is separated from the printing mask, a printing mask 30 is made to contact the surface of the substrate 20, and a solder paste 32 of low viscosity is supplied on the upper surface of the mask 30. By moving a squeegee 33 to roll the solder paste 32, the solder paste 32 is packed in a through hole 31 corresponding to an electrode 21 of the printing mask 30. |
