| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder ball supply device which can decrease the storage amount of solder balls in a supply container. SOLUTION: This device is provided with a storage container 55, which is arranged rotatably above a supply container 29 and discharges internally stored conductive balls 2 by a certain quantity each time it rotates, a hopper 49 which receives the conductive balls 21 discharged from the storage container 55, and a flexible tube 50 which has one end connected to the hopper 49 and the other end enabled to move between a standby position and the opening part of the supply container 29. |
