发明名称 AUTOMATIC CUTTING AND PRESSURE BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an automatic cutting and pressure bonding device allowing easy removal from a base table at the time of maintenance or repair of respective constituent parts and facilitating the location at assembling very much. SOLUTION: On the surface of a base table B, a plurality of knock pins (p) are installed protrusively in positions to serve as reference of each unit, and one or a plurality of threaded holes (h) are provided in positions apart from the knock pins (p). At the undersurface of each unit, a locating hole is formed to admit accurate fitting of a specified knock pin (p). When placed on the table B, the unit may be located by reference to the knock pin (p), the unit re-installation at the time of maintenance or repair can be performed easily.
申请公布号 JP2000123656(A) 申请公布日期 2000.04.28
申请号 JP19980288435 申请日期 1998.10.09
申请人 YAZAKI CORP 发明人 NOMOTO YOSHIAKI
分类号 H01B13/00;H01B13/012 主分类号 H01B13/00
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