Method for making wire connections of predetermined shape

摘要

The method provides a shaped wire connection between a first connection point (4) on a semiconductor chip (1) and a second connection point (5). A wire (3) runs through a capillary (12) which is moved horizontally and vertically by means of a programmed drive device (10). The capillary (12) serves both to fasten the wire to both connection points and also to guide the wire between the two points. After fastening the wire (3) to the first connection point (4), the capillary (12) is guided from the drive device along a predetermined track to the second connection point (5). In a first movement phase the capillary is driven to draw through the required length of wire. In a second phase it is driven along a curve downwards to the second connection point. At least in the second phase, the speed of the horizontal movement component is provided and the speed of the vertical movement component is thereby calculated on the basis of the track followed. The speed value of the horizontal component is adjusted according to the maximum permissible horizontal and/or vertical acceleration.