发明名称 COIL PARTS MOUNTING CIRCUIT SUBSTRATE DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a coil parts mounting circuit substrate device in which a leakage flux of coil parts is shielded as occasion demands, without impairing inductance characteristics. SOLUTION: In a coil parts mounting circuit substrate device 30, in which a thin type transformer 20 on which a magnetic core is mounted laterally, is surface-mounted in a circuit substrate 11, and a magnetic member 21 encloses an outside face of a coil 4 and an I-type magnetic core 14 of the thin type transformer 20 surface-mounted ranging over the entire periphery, which holding a clearances S of 0.3 mm to 2.0 mm, at a height H4 of a height dimension H3 or more of the thin-type transformer 20, and the magnetic member 21 is post-mounted on a substrate 11 separately from the thin-type transformer 20, as there is the clearance S between the thin-type transformer 20 and the magnetic member 21, fluctuations in inductance characteristics are avoided without venturing to structure a close magnetic path, and also release to a periphery of a leakage magnetic flux is reduced, thereby to be set so as to attain the shielding effects of preventing magnetic affects on other adjacent electronic parts W.</p>
申请公布号 JP2000124656(A) 申请公布日期 2000.04.28
申请号 JP19980288960 申请日期 1998.10.12
申请人 TAIYO YUDEN CO LTD 发明人 KIKUCHI KIICHI;EBINUMA YUJI;HOSAKA YASUO;UBUKATA TAKEHITO
分类号 H01F27/26;H01F27/36;H01F30/00;H05K9/00;(IPC1-7):H05K9/00 主分类号 H01F27/26
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