| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a flux coating method in which the coating amount of a flux to a solder bump formed on a semiconductor chip is controlled easily, by a method wherein, when the solder bump formed on the electrode of the semiconductor chip is coated with flux, a powdery flux is used. SOLUTION: The whole face of every solder bump 2 formed on every electrode of a semiconductor chip 1 is coated with a powdery flux 3. In this case, a solvent is put into a container, and the tip part of every solder bump 2 is immersed in the solvent so as to be coated. Then, by a proper method, the powdery flux 3 is supplied to the surface of every solder bump 2. The powdery flux 3 is stuck more easily to a part which is coated with the solvent out of the surface of the flux, the efficiency of a flux coating operation is enhanced, and the coating operation is controlled easily. In addition, it is possible to prevent the bridge of the flux, and it is not required to take the wet spread of the flux into consideration and to increase the uniformity of the height of every bump.</p> |
