发明名称 INFRARED RAY SENSOR AND WIRING METHOD OF BONDING WIRE
摘要 PROBLEM TO BE SOLVED: To prevent disturbance of an image (detection output) caused by irregular temperature distribution of an infrared ray detection element. SOLUTION: When wiring is carried out between an infrared ray detection element 2 and a lead pin 5, a Peltier element 4 is provided separately from a Peltier element 3 whereon the infrared ray detection element 2 is mounted and the infrared ray detection element 2 and the Peltier element 4 are connected by a bonding wire 6. Furthermore, the Peltier element 4 and the lead pin 5 are connected by the bonding wire 6, the temperature of a heat absorbing surface of the Peltier element 3 and the temperature of the Peltier element 4 are controlled almost constant, and heat transmitted to the infrared ray detection element 2 is restrained.
申请公布号 JP2000124474(A) 申请公布日期 2000.04.28
申请号 JP19980313919 申请日期 1998.10.19
申请人 NEC CORP 发明人 NISHISUGIYAMA AKIRA
分类号 H01L31/02;(IPC1-7):H01L31/02 主分类号 H01L31/02
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