| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the failure that a ceramic substrate connected and fixed to a ceramic container inner bottom surface by a conductive adhesive material falls off by an external impact. SOLUTION: This package is in the structure of fixing the bottom surface of the ceramic substrate 15 to the inner bottom surface of a ceramic container in a box body shape whose upper surface is opened or closed by a lid in a state of connecting the electrode of a crystal vibration element onto a pad on a step provided inside the ceramic container. An internal terminal 4 formed on the inner bottom surface of the ceramic container and a bottom part terminal 17 formed on the ceramic substrate bottom surface are connected and fixed by the conductive adhesive material 25. In this case, through-holes 20 are formed at positions corresponding to the respective bottom part terminals on the ceramic substrate, and at the time of connecting the internal terminal of the ceramic container and the bottom part terminal of the ceramic substrate, the conductive adhesive material 25 is filled inside the through-holes to enhance the fixation.
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