Method of forming a via plug in a semiconductor device and a semiconductor device using its method,申请号HK19980110979-传众专利搜索

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发明名称	Method of forming a via plug in a semiconductor device and a semiconductor device using its method
摘要
申请公布号	HK1010423(A1)	申请公布日期	2000.04.28
申请号	HK19980110979	申请日期	1998.09.25
申请人	HYUNDAI ELECTRONICS INDUSTRIES CO. LTD.	发明人	KYEONG KEON CHOI
分类号	H01L21/768;(IPC1-7):H01L	主分类号	H01L21/768
代理机构		代理人
主权项
地址

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