发明名称 EQUIPMENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MOUNTING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an equipment and a method for manufacturing an electronic component mounting board, which can increase productivity more than the conventional ones. SOLUTION: This equipment is provided with a solder cream printing device 131, an electronic component mounting device 261, and a transfer device 121 having a belt 122 which carries a circuit board on it. While being carried on the belt, a circuit board is printed with solder cream by the solder cream printing device and mounted with electronic components by the electronic component mounting device. Thereby, unlike the convention method, the moving and mounting operation of electronic components is no longer necessary, so that productivity is increased. Moreover, the printing of the solder cream by the solder cream printing device is conducted in synchronism with the transfer of the circuit board by the belt, which further increases the productivity.
申请公布号 JP2000124682(A) 申请公布日期 2000.04.28
申请号 JP19980296846 申请日期 1998.10.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SATO KENICHI;OTANI HIROYUKI;FUJIWARA MUNEYOSHI;YAMAUCHI TOSHIAKI;OKAMOTO KENJI;MIYAGAWA HIDEKI;YASUTAKE MASANORI
分类号 H05K13/04;H05K3/34 主分类号 H05K13/04
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