| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which can produce a build-up type multilayer printed wiring board which uses a resin sheet with copper foil in good yield, without wrinkles of the copper foil and the embossement and gouging of a pattern. SOLUTION: The multilayer printed wiring board is manufactured by stacking wiring layers by repeating a process wherein an internal-layer circuit board, having conductor circuit patterns formed on one or both the surfaces and resin sheets with copper foil carries stack on one or both the surfaces of the internal circuit substrate are sandwiched between metal mold plates and thermally pressed, and resin sheets with masking copper foil formed by masking both the copper exposed surfaces and resin exposed surfaces of resin sheets with copper foil carries for protection are used as the resin sheets with the copper foil carries. |
