发明名称 ALIGNER AND MANUFACTURE OF DEVICE
摘要 PROBLEM TO BE SOLVED: To quickly deal with a substrate not recognizable by a sensor, without any risk by recovering the substrate by substrate carrying means when the sensor becomes unable to recognize the substrate being carried by the substrate carrying means. SOLUTION: A wafer is carried to start an exposure processing. When the wafer is carried to a realignment (PA) stage 402 and becomes not recognizable to stop the sequence because of the sensing error of the wafer, a sending hand 405 sends the wafer from the PA stage 402 to a stage 403 according to a desired command input operation, a carrying hand 404 carries the wafer to a carrier 401, then the sequence starts to resume the exposure processing, and the wafer recovered on the wafer carrier 401 is again carried to make the exposure processing. Thus the carrying hand 404 or the sending hand 405 recovers the lost wafer, hence workers need not handle the wafers with their hands and the work efficiency rises.
申请公布号 JP2000124123(A) 申请公布日期 2000.04.28
申请号 JP19980313958 申请日期 1998.10.19
申请人 CANON INC 发明人 TAZAWA SEITA
分类号 H01L21/027;G03F7/20;(IPC1-7):H01L21/027 主分类号 H01L21/027
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