| 摘要 |
PROBLEM TO BE SOLVED: To radiate heat to the outside of an equipment case, without large- sizing the entire equipment or being adversely affected on electronic components within the device case, due to heat. SOLUTION: A key board 4 is provided on an upper face of an equipment case 1 provided with a circuit substrate 14 inside, having semiconductor devices 16, 17 in response to the circuit substrate 14, and a chassis 10 made of a metal of the key board 4 is connected to the semiconductor devices 16, 17 to make thermal conduction by a thermal conduction member 15. Accordingly, even if the semiconductor devices 16, 17 of the circuit substrate 14 generate heat at use, the heat is transmitted to the chassis 10 made of a metal of the key board 4 by means of the thermal conduction member 15, and it is possible to radiate heat upwards of the key board 4 by the chassis 10, whereby it is possible to set so that adverse effects on electronic components within the equipment case 1 due to heat, and moreover as a conventional heat radiator is not used, it is possible to contrive to make the overall equipment thin and miniaturized.
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