| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductor pattern forming method, where a conductor pattern can be easily formed in a finely adjustable manners. SOLUTION: A groove pattern 12 corresponding to a conductor pattern is formed on the surface 10A of an insulating board 10 by laser processing. Then, a conductor film 14 is formed on all the surface 10A of the board 10 where the groove pattern 12 is provided by evaporation or sputtering. Then, all the surface of the surface 10A of the board 10 is polished to remove the conductor film 14 except its residual part in the groove pattern 12. By this setup, a part of the conductor film 14 present in the groove pattern 12 is left unremoved, the other conductor film 14 is removed, and a conductor pattern 16 is formed extending along the groove pattern 12. A releasing agent 28 is applied onto the surface 20A of an insulating board 20, a groove pattern 22 is provided, and a conductor film 24 is formed on all the surface 20A of the board 20. A part of the conductor film 24 except its residual part staying in the groove pattern 22 is separated off, and a conductor pattern 26 is formed of conductor filled in the groove pattern 22.
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