| 摘要 |
PROBLEM TO BE SOLVED: To improve thermoelectric performance by applying a pressing force to a thermoelectric semiconductor material to extruding it from an extruding die, molding the extruded molded product, and orienting the C plane of crystal constituting its structure in the extruding direction. SOLUTION: A pressing force is applied to a rectangular parallelepiped sintered body 15 made of thermoelectric semiconductor material having a desired composition in the extruding direction by a punch, so that the sintered body 15 is extruded from the rectangular parallelepiped extruding outlet 14a of an extruding die 14 so as to mold a rectangular parallelepiped extruded molding product 15 having a smaller cross section than that before molding, In this molding process, the rectangular parallelepiped sintered body 15 is deformed in the direction of one axis E of two axes E and F vertical to the extruding direction D in the extruding die 14 while the deformation in the direction of the other axis F thereof is constrained. Thus, thermoelectric performance, etc., can be improved as compared with hot forging.
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