发明名称 SUBSTRATE TREATMENT SYSTEM AND CONTROL APPARATUS ATTACHED TO THE SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment system, allowing the equipment cost to be lowered and to improve the substrate treating efficiency by increasing the number of treating chambers which can be installed in one treatment system. SOLUTION: A substrate treatment system, having a plurality of treating chambers 1A, 1B, 1C, etc., comprises a controller 13 for controlling so as to make different the drive timings of individual power source circuits 11A, 11B, 11C, etc. The controller 13 stores beforehand the allowable number of temp.- adjusting stages 3 which have overlapped temp. rise times, counts the number of the temp.-adjusting stages 3 having overlapped temp. rise times and adjusts the timings of driving the individual power source circuits 11A, 11B, 11C, etc., so as that counted number does not exceed the allowable number, when starting each cycle of each temp.-adjusting stage 3.
申请公布号 JP2000124100(A) 申请公布日期 2000.04.28
申请号 JP19980293379 申请日期 1998.10.15
申请人 KOMATSU LTD 发明人 ENDO TAKAYOSHI
分类号 H01L21/683;G03F7/30;H01L21/027;H01L21/68;H02J3/00 主分类号 H01L21/683
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