发明名称 CONTACTLESS IC MODULE AND ITS PRODUCTION AND CONTACTLESS IC CARD
摘要 PROBLEM TO BE SOLVED: To provide a contactless IC module which is used for an IC card and can improve its yield, to provide a contactless IC card which contains the contactless IC module and to provide the methods for production of those IC module. SOLUTION: A contactless IC module comprises a contactless IC inlet 5 having at least an IC chip 3 and an antenna 4 connected to the chip 3, and a protective member 6 which covers the inlet 5. At least a part of the member 6 can transmit the visible light. The inlet 5 is covered with the member 6 and then blanked after confirming its position. Thus, the module is produced in the form of a package.
申请公布号 JP2000123137(A) 申请公布日期 2000.04.28
申请号 JP19980297353 申请日期 1998.10.19
申请人 DAINIPPON PRINTING CO LTD 发明人 HONDA SHIKO;TAKAHASHI NOBUYUKI
分类号 G06K19/07;B42D15/10;G06K19/077 主分类号 G06K19/07
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