| 摘要 |
PROBLEM TO BE SOLVED: To increase the number of products (resin-sealed moldings) which are formed in one cycle to improve the productivity. SOLUTION: A resin-sealing die composed of an upper die 1, lower die 2 and intermediate die 3 comprises resin-forming upper layer cavities 4, 5 which are provided between the upper and intermediate dies (upper 1) and lower layer cavities 6, 7 provided between the intermediate die and a lower die (lower layer), electronic components mounted on lead frames are set separately in the upper and lower layer cavities 4, 5, 6, 7 and molten resin materials are injected into the upper and lower layer cavities 4, 5, 6, 7 separately by layer so as to seal the electronic components with the resin in the upper and lower cavities 4, 5, 6, 7.
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