发明名称 CARD-TYPE CIRCUIT MODULE DEVICE AND MOUNTING BOARD USED THEREIN
摘要 PROBLEM TO BE SOLVED: To provide a card-type circuit module device which has high heat radiating efficiency and a mounting board used therein. SOLUTION: In a card-type circuit module device in which a circuit element containing a heat generating element 1 is mounted, and a mounting board 2 constituting a specified circuit module is stopped on a conductive frame 3 enclosing the mounting board 2, a contact part with the conductive frame 3 of the mounting board 2 has a ground land 7 connected with an inner layer ground layer 6, via a conductive layer 5 formed in an inner wall of a stopper insertion part 4 into the conductive frame 3 of the mounting board 2, and has a heat transmission path for transmitting heat to the conductive frame 3 via the inner layer ground layer 6.
申请公布号 JP2000124644(A) 申请公布日期 2000.04.28
申请号 JP19980288962 申请日期 1998.10.12
申请人 PFU LTD 发明人 IKEDA SATOSHI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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