发明名称 MANUFACTURE OF CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent short-circuit failures due to plating stretching, by setting the surface of a retaining table, in such a manner that 'Oken system' (set by laboratory of Oji Paper Co., Ltd.) degree of smoothness is set to a specified value, and cutting a green sheet mounted on the retaining table in accordance with the arrangement of electronic component elements. SOLUTION: A green sheet 1 is formed by laminating a plurality of ceramic sheets 11-16. The ceramic sheets 11-16 are those which are yet to be baked. On at least one from among the ceramic sheets 11-16, e.g. the ceramic sheet 14, a large number of electronic component elements are arranged. The green sheet 1 is mounted on a surface 31 of a retaining table 3. The surface 31 of the retaining table 3 is so set that the 'Oken' system (set by laboratory of Oji Paper Co., Ltd.) degree of smoothness becomes at least 600 seconds. The green sheet 1 mounted on the retaining table 3 is cut in an X-direction and a Y-direction, in accordance with arrangement of the electronic component elements. Cutting of the green sheet 1 is performed by using a disk-type rotary blade 4.
申请公布号 JP2000124060(A) 申请公布日期 2000.04.28
申请号 JP19980297407 申请日期 1998.10.19
申请人 TDK CORP 发明人 TANAKA RYUICHI;OGASAWARA TADASHI;ODA KAZUHIKO
分类号 H01G4/12;H01C7/02;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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