| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor oxidizing apparatus which can safely conduct oxidization with high productivity and can prevent deterioration of surfaces due to oxidization. SOLUTION: In a semiconductor oxidizing device which thermally oxidizes a laminated semiconductor body housed in a reaction furnace 1 by using steam flowing in the furnace 1, a means 8 which removes condensed dew water is installed to the furnace 1, and an evacuating means 9 is provided on the downstream the furnace 1. Downstream the furnace 1, a gas removing means 10 for an AsH3 gas and/or a PH3 gas is provided as necessary, in addition to the evacuating means 9. Upstream the furnace 1, in addition, a supply line 12 for the AsH3 gas and/or the PH3 gas is provided, as necessary.
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