发明名称 |
Verfahren zum Schleifen von Halbleiterwafern und Gerät dafür |
摘要 |
A method of polishing semiconductor wafers and apparatus therefor, wherein a semiconductor wafer (W) mounted on the lower side of a wafer mounting plate (19) may be polished on a polishing pad (32) by the front referenced polishing technique due to a flexibility of the wafer mounting plate to make the same conform in detail with the backside contour of the wafer under polishing pressure and a selected flexibility differential between a wafer holding region (20) and an outer moving region (21) of the wafer mounting plate (19). An apparatus according to an aspect of the present invention is structured in such a manner that the wafer mounting plate (19) also functions as a vacuum chuck plate constructed of a flexible thin disc of hard plastics, a central round region is used for a wafer holding region (20) facing the backside of the wafer and an outside annular region is more flexible to function as a moving region (21). <IMAGE> |
申请公布号 |
DE69419479(T2) |
申请公布日期 |
2000.04.27 |
申请号 |
DE1994619479T |
申请日期 |
1994.08.31 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
TANAKA, KOUICHI;HASHIMOTO, HIROMASA;SUZUKI, FUMIO |
分类号 |
B24B37/04;B24B37/30;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|