| 摘要 |
PROBLEM TO BE SOLVED: To improve the solder reflow resistance of a plastic mold type HQFP, which is formed by sticking together a heat radiation plate on a lead frame across an insulating layer, and improving the adhesive strength between an adhesive and mold resin. SOLUTION: The surface of an adhesive surface 13a of the adhesive-coated Cu strip 10, which forms a heat radiating plate coming into contact with the mold resin, is made rough. Consequently, the adhesiveness of the mold resin 37 becomes better through anchor effect, and the adhesive strength is improved. The roughness of the adhesive surface 13a is Ra (center-line means roughness), and when it is 0.5μm or higher, the effect on the adhesive strength improvement becomes striking. Effects can be obtained with either a thermoplastic or a thermosetting adhesive, and a Cu plate may be a rolled or electrolytic Cu strip. |
