发明名称 IN-LINE OPTOELECTRONIC DEVICE PACKAGING
摘要 <p>A fiber connector that facilitates alignment of and electrical communication with electrooptical devices on an optical fiber or interposed between optical fibers. An embodiment of in-line optoelectronic device packaging (10) constructed according to principles of the invention includes a ferrule (20) configured to receive an optical fiber with an optoelectronic device (D) mounted on one end of the ferrule, for alignment with the fiber. Electrically-conductive deposits (30) along the side of the ferrule supply electical energy to or conduct electrical signals from the optoelectronic device (D). The optoelectronic device-carrying ferrule is inserted in a ceramic sleeve (40). Another ferrule (120), maintaining another optical fiber (115), also is inserted in the ceramic sleeve (40). Another embodiment constructed according to principles of the invention includes a second optoelectronic device mounted on the second ferrule (120). The electrically-conductive deposits permit ready serial deployment of optoelectronic devices, such as a variable attenuator or VCSEL laser emitter, between the optical fibers maintained by the ferrules in the sleeve.</p>
申请公布号 WO2000023838(A1) 申请公布日期 2000.04.27
申请号 US1999024818 申请日期 1999.10.22
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