| 摘要 |
<p>A wafer-polishing apparatus using a chemical and mechanical process comprises first and second polishing pads (14, 15); first and second wafer-holding heads (31, 32); a wafer loading section (41); a wafer unloading section (42); first and second head-driving mechanisms for turning the first and second wafer-holding heads above the polishing pad, the wafer loading section (41) and the wafer unloading section (42); a first transport mechanism for carrying wafers to the wafer loading section; and a second transport mechanism for carrying wafers from the wafer unloading section. The first and second polishing pads are adjacent to each other, the wafer loading section and the wafer unloading section are adjacent to each other, the first polishing pad and the wafer loading section are arranged diagonally opposite to each other, and the second polishing pad and the wafer unloading section are arranged diagonally opposite to each other. Since the different transport mechanisms carry wafers to the wafer loading section and from the wafer unloading section, respectively, wafers are substantially protected from dust before polished.</p> |
