发明名称 METHOD AND APPARATUS FOR CUTTING OBJECTS
摘要 <p>The invention concerns apparatus and method for automatic cutting of objects into portions of reduced dimension. More specifically the invention concerns a cutting device (9) placed horizontally over a transporting conveyor (3). The cutting device is further operatively connected to a computer (6) and moveable in an up- and downward direction with respect to the conveyor. The characteristics of the object to be cut are determined. By utilising at least one of the characteristics to establishing the desired cutting pattern one is able to cut the object into portions of predetermined thickness by band saw cutting blade (7).</p>
申请公布号 WO2000022934(A1) 申请公布日期 2000.04.27
申请号 IS1999000012 申请日期 1999.10.20
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