Wärmebeständige Isolationsschicht, Grundplatte für eine Leiterplatte unter Verwendung dieser und Verfahren zur Herstellung der Leiterplatte

摘要

A base plate for a printed circuit board, having a conductive foil heat-bonded to at least one side of a film insulator which comprises from 65 to 35 wt % of a polyarylketone resin and from 35 to 65 wt % of a non-crystalline polyether imide resin and of which the glass transition temperature is from 150 to 230° C. and the peak temperature of crystal fusion is at least 260° C., as measured when the temperature is raised in the differential scanning calorimetry, if necessary after forming a through-hole and filling a conductive paste therein, and of which, after the heat bonding, the heat of crystal fusion DELTAHm and the heat of crystallization DELTAHc generated by crystallization during the temperature rise, as measured when the temperature is raised by the differential scanning calorimetry, satisfy the following relation: