| 摘要 |
<p>An IC card suited to low-cost mass production, comprising a flat coil formed on a press or by etching. The flat coil (10), formed on press, includes a plurality of turns of a conductor (11) wound in substantially the same plane, and its ends (10a and 10b) are connected electrically with terminals (12a and 12b) of a semiconductor device (12). One end (10a) of the flat coil (10) is located outside, while the other end (10b) is inside. The semiconductor device (12) is opposed on its front or rear side to the conductor (11) of the flat coil (10). The terminals (12a and 12b) of the semiconductor device (12) are located adjacent to, and connected electrically with, the outside and inside ends (10a and 10b) of the flat coil (10), respectively. <IMAGE></p> |
