| 摘要 |
A method is provided for destroying a target component, such as hydrocarbons, halogenated hydrocarbons, diethyl-4-nitrophenylphosphate (paraoxon), 2-chloroethyl ethyl sulfide (2-CEES), dimethylmethylphosphonate (DMMP), bacteria such as Bacillus Cereus, Bacillus Globigii, Chlamydia and/or Rickettsiae, fungi and viruses, by contacting the target component with an adsorbent such as MgO, CaO, TiO2, ZrO2, FeO, V2O5, V2O3, Mn2O3, Fe2O3, NiO, CuO, Al2O3, ZnO and mixtures thereof wherein the adsorbent contains either reactive atoms selected from the group consisting of halogens and alkali metals stabilized on the surfaces of the adsorbent or ozone and wherein the contacting is conducted at a temperature of -40 to 600 DEG C. for a time period of at least about 4 seconds. The adsorbent may be in the form of solids having a size of about 3 to 20 nanometers or in the form of pellets having a size of at least 1 millimeter. |
