Novel composite foil, process for producing the same and copper-clad laminate

摘要

A composite foil comprising a conductive carrier, an organic release layer coating a surface of the conductive carrier, and a conductive particle layer formed on the organic release layer. A process for producing a composite foil, comprising the steps of forming an organic release layer on a surface of a conductive carrier, and electrodepositing a conductive particle layer on the organic release layer. A copper-clad laminate comprising the above composite foil laminated to a base material. A copper-clad laminate comprising the above composite foil laminated to a base material, having only the conductive carrier removed therefrom. Thus, there are provided a composite foil for printed wiring board production from which a copper-clad laminate enabling laser perforating without forming burrs even at lower laser power and further enabling forming fine-pitch wiring patterns can be produced, a process for producing the composite foil and a copper-clad laminate produced therefrom. <IMAGE>