发明名称 ALUMINUM ALLOY PLATE MATERIAL FOR PRESS MOLDING EXCELLENT IN ANTI-ADHESION CHARACTERISTIC AND ITS MANUFACTURE, AND PART FOR ELECTRONIC EQUIPMENT USING ALUMINUM ALLOY PLATE MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To prevent sticking of a workpiece after pressing and blocking at the time of transporting without adding particles to an organic resin layer by providing the organic resin layer having a specified degree of roughness on at least one side of an aluminum alloy plate having scaly unevenness on the surface. SOLUTION: An aluminum alloy plate material is composed by forming an organic resin layer on at least one side of an aluminum alloy plate having scaly unevenness on a surface. The scaly unevenness is a shape wherein fine recesses present continuously on the surface of the plate which appear like scales of a fish. For example, the unevenness is transferred to a rolled plate by a shot dull roll which is roughened on the surface by applying shot blasting to a pressure roll, or an electrically deposited and treated roll which is electrically roughened on the surface of a pressure roll. A degree of roughness of the organic resin layer is 2-15μm in ten point average roughness (Rz). A polyester resin is preferable for a resin of the organic resin layer.</p>
申请公布号 JP2000117895(A) 申请公布日期 2000.04.25
申请号 JP19980288369 申请日期 1998.10.09
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 OGURA KENICHI;SATO TAKAHIRO;OTA MASARU
分类号 G06F1/16;B05C9/14;B05D3/12;B05D7/14;B05D7/24;B32B15/08;B32B15/09;B32B15/20;(IPC1-7):B32B15/20 主分类号 G06F1/16
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