发明名称 HEAT-RESISTANT RESIN COMPOSITION AND ELECTROCONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To obtain a novel resin composition having excellent heat resistance, low hygroscopicity, and excellent flexibility by selecting a composition essentially consisting of a cyclic Schiff compound obtained by reacting a diamine compound with a dialdehyde compound. SOLUTION: A heat-resistant resin composition is obtained which essentially consists of a cyclic Schiff compound obtained by reacting a diamine compound represented by formula III (wherein X is-CH = or -N; R1 is H, a lower alkyl, a lower alkoxide, a halogen, or a lower fluoroalkyl) with a dialdehyde compound represented by formula IV (wherein Y is -CH = or -N =; R2 is H, a lower alkyl, a lower alkoxide, a halogen, or a lower fluoroalkyl) and represented by at least either of formula I and II (wherein X, Y, R1, and R2 are each as defined in formula III or formula IV). This composition is polymerized by heating and/or irradiation with an electromagnetic wave at a wavelength of 300-10,000 nm to obtain a cured product having high crystallinity and excellent heat resistance.
申请公布号 JP2000119442(A) 申请公布日期 2000.04.25
申请号 JP19980293289 申请日期 1998.10.15
申请人 HITACHI LTD 发明人 SUZUKI MASAHIRO;NISHIKAWA AKIO;KATAGIRI JUNICHI
分类号 H05K1/03;C08G73/06;C08K5/3477;C08L87/00;C09J9/02;C09J163/00;C09J179/04;(IPC1-7):C08K5/347 主分类号 H05K1/03
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