| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyimide blend film having a high elasticity, a low coefficient of thermal expansion, and excellent alkali etching resistance by using a binary copolyamic acid blend obtained by blending a polyamic acid comprising pyromellitic dianhydride and phenylenediamine and a ternary copolyamide comprising pyromellitic dianhydride, phenylenediamine, and diaminodiphenyl ether. SOLUTION: It is desirable that the ternary copolyamic acid comprises pyromellitic dianhydride, 10-90 mol%, based on the diamine component, phenylenediamine, and 10-90 mol%, based thereon, diaminodiphenyl ether. It is desirable that the mixing ratio of the weight (in terms of the solid matter) of the binary copolyamic acid to that of the ternary copolyamic acid is in the range of 1/9 to 9/1, the diaminodiphenyl ether is 4,4-diaminodiphenyl ether, and the phenylenediamine is p-phenylenediamine.
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