COMPOSITION USED IN PRODUCTION OF CIRCUIT PART MATERIAL OR PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To obtain the subject composition useful for making a circuit part material on a printed wiring board, or as a material suitable for a passive part material in a semiconductor industry, especially as a re-processible material by including a specific maleimide compound, or the like. SOLUTION: This composition contains (A) a maleimide compound (e.g. N-butylphenylmaleimide) of the formula: [M-Xm]n-Q [(m) is 0 or 1; (n) is 1-6; M is a maleimide part of formula I (R1 is H or a 1-5C alkyl); X is an aromatic group having a structural formula of formula II; Q is an alkyl, an alkyloxy, an alkylamine or the like] and (B) a free radical initiator and (C) a photoreaction initiator or a hardening initiator selected from combinations of the components (B) and (C).