发明名称 POSITIVE RESIST COMPOSITION
摘要 PURPOSE: A positive resist composition is structured to improve the decomposition performance and sensitivity when it is exposed to light having a wave less than 220 nm and to have high dry-etching resistance and adhesive property with respect to a board. CONSTITUTION: A positive resist composition includes a compound for generating acid with respect to radiation or other chemical radiation and a resin decomposed by a reaction with the acid so that solubility can be increased within a developing solution. The resin has a cross-linkage structure and a multi-link type radical. The cross-linkage structure is an acid composition acetyl ester structure which can be decomposed by the acid. The composition may further include an acid decomposition solution-preventing compound having a molecular weight less than 3,000. The acid decomposition solution-preventing compound has a radical that can be decomposed by a reaction with the acid and increased in solubility within an alkali developing solution.
申请公布号 KR20000023329(A) 申请公布日期 2000.04.25
申请号 KR19990040590 申请日期 1999.09.21
申请人 FUJI PHOTO FILM CO., LTD. 发明人 AOAI TOSHIAKI;SATOKEN ICHIROO
分类号 H01L21/027;C08F8/14;C08F20/10;C08L101/02;C09D201/02;G03F7/004;G03F7/039;(IPC1-7):G03F7/039 主分类号 H01L21/027
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