发明名称 |
POSITIVE RESIST COMPOSITION |
摘要 |
PURPOSE: A positive resist composition is structured to improve the decomposition performance and sensitivity when it is exposed to light having a wave less than 220 nm and to have high dry-etching resistance and adhesive property with respect to a board. CONSTITUTION: A positive resist composition includes a compound for generating acid with respect to radiation or other chemical radiation and a resin decomposed by a reaction with the acid so that solubility can be increased within a developing solution. The resin has a cross-linkage structure and a multi-link type radical. The cross-linkage structure is an acid composition acetyl ester structure which can be decomposed by the acid. The composition may further include an acid decomposition solution-preventing compound having a molecular weight less than 3,000. The acid decomposition solution-preventing compound has a radical that can be decomposed by a reaction with the acid and increased in solubility within an alkali developing solution.
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申请公布号 |
KR20000023329(A) |
申请公布日期 |
2000.04.25 |
申请号 |
KR19990040590 |
申请日期 |
1999.09.21 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
AOAI TOSHIAKI;SATOKEN ICHIROO |
分类号 |
H01L21/027;C08F8/14;C08F20/10;C08L101/02;C09D201/02;G03F7/004;G03F7/039;(IPC1-7):G03F7/039 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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