发明名称 |
Stabilization of slurry used in chemical mechanical polishing of semiconductor wafers by megasonic pulse |
摘要 |
A method and apparatus for conditioning a slurry used in a chemical mechanical polishing apparatus is disclosed. Megasonic generators are provided along the piping network between a slurry reservoir and the CMP apparatus. A megasonic generator may also be placed adjacent to the slurry reservoir. The megasonic generators discourage the formation of agglomerate particles, which in turn reduces the number of defects caused by the large particles in the slurry.
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申请公布号 |
US6053802(A) |
申请公布日期 |
2000.04.25 |
申请号 |
US19990324689 |
申请日期 |
1999.06.03 |
申请人 |
PROMOS TECHNOLOGIES, INC.;MOSEL VITELIC, INC.;SIEMENS AG |
发明人 |
YI, CHAMPION;TUNG, JEN-CHIEH;WANG, JIUN-FANG |
分类号 |
B24B1/04;B24B37/00;B24B55/00;B24B57/02;(IPC1-7):B24B7/19;B24B7/30 |
主分类号 |
B24B1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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