| 摘要 |
A method and device for handling fabrication articles in an electronics application includes a pickup head with an array of article-holding slots aligned to receive the articles and includes a drive mechanism for tilting the pickup head. Cantilevered support members, such as support rods, have first ends attached to the pickup head and are arranged to form article-receiving regions that are generally aligned with the article-holding slots. In the preferred embodiment, the article-holding slots have a geometry for supporting the fabrication articles when the support members are in an upright condition, i.e. when the articles are vertically oriented. Also in the preferred embodiment, the device includes stops that prevent the articles from entering the slots when the support members are in a horizontal condition. The stops provide a controlled exit and entrance of the articles from and into the slots as the pickup head is tilted, thereby reducing the risk of breakage. Typically, the fabrication articles are semiconductor wafers.
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