发明名称 |
Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
摘要 |
Printed circuit substrates and electrical assemblies including a conductive composition are disclosed. The printed circuit substrate and the electrical assembly embodiments comprise a first conducting region and a second conducting region. A dielectric layer is disposed between the first and second conducting regions. An aperture is disposed in the dielectric layer and a via structure including the conductive composition is disposed in the aperture. The conductive composition is preferably in a cured state and electrically communicates with the first and second conducting regions. In preferred embodiments, the conductive composition comprises conductive particles in an amount of at least about 75 wt. % based on the weight of the composition. At least 50% by weight of the conductive particles have melting points of less than about 400 DEG C. The composition further includes a carrier including an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier. The epoxy functional resin can have a viscosity of less than about 1000 centipoise at 25 DEG C.
|
申请公布号 |
US6054761(A) |
申请公布日期 |
2000.04.25 |
申请号 |
US19980203126 |
申请日期 |
1998.12.01 |
申请人 |
FUJITSU LIMITED |
发明人 |
MCCORMACK, MARK THOMAS;JIANG, HUNT HANG;BEILIN, SOLOMON I.;CHAN, ALBERT WONG;TAKAHASHI, YASUHITO |
分类号 |
C08K3/00;C08L63/00;H01L23/498;H05K3/40;H05K3/46;(IPC1-7):H01L23/04 |
主分类号 |
C08K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|