| 摘要 |
PURPOSE: A mouthed for wire bonding is provided to form a stable wire loop shape by preventing swell of the wire loop at a time of bonding to a second bond point and to decrease the number of the wire loop of a low step difference device. CONSTITUTION: A ball formed at the prior stage of a wire(1) protruded from the prior stage of a capillary(2) is bonded at a first bond point(A). Then, when the capillary(2) moves to a second bond point(C), the capillary(2) is dropped somewhat to the first bond point(A) and a wire part(15,17) drooped from the prior stage of the capillary(2) is pushed and bonded in a horizontal plane(20). Then, the capillary(2) rises and moves to upper direction of the second bond point(C), the capillary(2) drops and the wire(1) is bonded at the second bond point(C). |
