SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A method for manufacturing a semiconductor is provided to reduce an area necessary for a printed circuit board and then reduce the cost for the board by arranging coating lead wires on a removal area for a bonding connection. CONSTITUTION: An electrolytic plating is performed on an external input/output terminal portion (20) and a bonding pad(21a) while supplying power source from a coating lead wire(19) of a circuit board(4a). A window portion is formed by removing the coating lead wire(19) and an area corresponding to a center pad of a semiconductor chip. An insulating film is attached on the semiconductor chip for the center pad to be exposed from the window portion. The bonding pad(21a) and the center pad are connected by bonding wire. External input/output terminals(20) are formed on the external input/output portion.