发明名称 METHOD FOR CORRECTING DISCHARGE AMOUNT OF SECONDARY ELECTRON FOR PREVENTING WAFER CHARGE UP OF ION INJECTING EQUIPMENT
摘要 PURPOSE: A method for correcting a discharge amount of a secondary electron is to prevent a wafer charge up of an ion injecting equipment. CONSTITUTION: An ion injecting equipment comprises an electron flood gun(2) for discharging a first electron and a faraday(4) for discharging a secondary electron to be entered to the wafer by a collis ion with the first electron. The discharging amount of the first electron is regulated according to a bias voltage(E1,E2). The discharging amount of the secondary electron is regulated according to a bias voltage(E3) connected to the faraday. The faraday is formed to surround the front of a wafer(WF) to which an ion beam is entered. The ion beam is to irradiate a compound ion as source for doping the wafer. The secondary electron is to prevent a charge up of the wafer to be electric charged by an incidence of the ion beam.
申请公布号 KR20000021228(A) 申请公布日期 2000.04.25
申请号 KR19980040232 申请日期 1998.09.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, MUN HUI
分类号 H01L21/48;H01L21/265;(IPC1-7):H01L21/48 主分类号 H01L21/48
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