发明名称 |
METHOD FOR CORRECTING DISCHARGE AMOUNT OF SECONDARY ELECTRON FOR PREVENTING WAFER CHARGE UP OF ION INJECTING EQUIPMENT |
摘要 |
PURPOSE: A method for correcting a discharge amount of a secondary electron is to prevent a wafer charge up of an ion injecting equipment. CONSTITUTION: An ion injecting equipment comprises an electron flood gun(2) for discharging a first electron and a faraday(4) for discharging a secondary electron to be entered to the wafer by a collis ion with the first electron. The discharging amount of the first electron is regulated according to a bias voltage(E1,E2). The discharging amount of the secondary electron is regulated according to a bias voltage(E3) connected to the faraday. The faraday is formed to surround the front of a wafer(WF) to which an ion beam is entered. The ion beam is to irradiate a compound ion as source for doping the wafer. The secondary electron is to prevent a charge up of the wafer to be electric charged by an incidence of the ion beam.
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申请公布号 |
KR20000021228(A) |
申请公布日期 |
2000.04.25 |
申请号 |
KR19980040232 |
申请日期 |
1998.09.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, MUN HUI |
分类号 |
H01L21/48;H01L21/265;(IPC1-7):H01L21/48 |
主分类号 |
H01L21/48 |
代理机构 |
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主权项 |
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地址 |
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