| 摘要 |
PURPOSE: A semiconductor component and fabricating method therefor, a structure for mounting the semiconductor component and mounting method therefor are provided to improve the contact strength of a land terminal at a time of semiconductor component mounting and to provide a sufficient margin to arrangement pitch of a wire passing the land terminal. CONSTITUTION: A semiconductor component comprises land terminals(22a,22b,22c) for bump arranged as a grid pattern and connected to the electrode pad surface through re-arrangement wires on a substrate. The land terminals for bump is divided into external land terminals(22a) arranged at the circumference of the substrate and internal land terminals(22c) arranged at inner side of the external land terminals. Each external land terminal has a diameter larger than that of each internal land terminal. |
