发明名称 |
WET ETCHING EQUIPMENT OF SEMICONDUCTOR |
摘要 |
PURPOSE: A wet etching equipment of a semiconductor is to treat a wafer uniformly by preventing a partial eddy or a stagnated zone from generating in a bath. CONSTITUTION: In a wet etching equipment of a semiconductor, a bath(10) accommodates a small amount of chemical. A chemical supplying unit supplies a predetermined amount of chemical to the bath. A chemical exhausting unit exhausts the chemical accommodated in the bath to the outside. A wafer guide(30) locates a plurality of wafers(1) fixed horizontally so that a used surface of the wafer looks down, in a chemical solution. A transporting robot loads and unloads the water into the wafer guide. A chemical jetting unit(20) jets the chemical on the surface of the wafer at high pressure so that a flow of the chemical is formed. The bath has a cylinder shape with an upper surface opened.
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申请公布号 |
KR20000021469(A) |
申请公布日期 |
2000.04.25 |
申请号 |
KR19980040567 |
申请日期 |
1998.09.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, SEUNG GEON;JEONG, JAE HYEONG;YUN, YEONG HWAN;KWAK, GYU HWAN |
分类号 |
H01L21/306;H01L21/00;H01L21/304;H01L21/3063;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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