发明名称 APPARATUS AND METHOD FOR MOUNTING ELECTRONIC PARTS
摘要 PURPOSE: An apparatus and a methode for mounting electronic parts are provided to pick up and analyze simultaneously a multitude of electronic parts by utilizing a multi head portion. CONSTITUTION: An apparatus for mounting electronic parts comprises a multi head portion (110), a transferring robot(120), a camera(130), a trigger device(140), and a controller(150). The multi head portion picks up electronic parts from a part supply device and has a multitude of absorption heads(112) for mounting the electronic parts on a printed circuit board(101). The transferring robot moves the multi head portion between the part supply device and the printed circuit board. The camera photographs each part absorbed to the absorption head. The trigger device senses the movement of the multi head portion and transmits a photographing signal to the camera. The controller analyzes photographed images and corrects mounted locations of the absorbed electronic parts.
申请公布号 KR20000021713(A) 申请公布日期 2000.04.25
申请号 KR19980040958 申请日期 1998.09.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SEONG, PHIL YOUNG;BYUN, HO JAE;OH, BYUNG JUN
分类号 H05K13/04;(IPC1-7):H05K13/04 主分类号 H05K13/04
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