METHODS AND APPARATUSES FOR CLAMPING AND DECLAMPING A SEMICONDUCTOR WAFER IN A WAFER PROCESSING SYSTEM

摘要

PURPOSE: An apparatus is provided for the improved method clamping and declamping a semiconductor wafer in the processing chamber of a wafer processing system, and for clamping a wafer to an electrostatic chuck having a substantially resistive dielectric layer disposed thereon. CONSTITUTION: The apparatus relates to the production of semiconductor device. The method includes the step of providing a build up voltage having a first polarity to a pole of the electrostatic chuck to cause a potential difference to build up between a first region of the substantially resistive dielectric layer and a second region of the wafer that overlies at least a portion of the first region. The potential difference gives rise to a clamping force to clamp the wafer to the electrostatic chuck. The method further includes the step of terminating the build up voltage when the clamping force substantially reaches a predefined level. There is further included the step of providing a holding voltage to the pole of the electrostatic chuck to substantially maintain the clamping force at the predefined level. The holding voltage has the first polarity and a magnitude that is lower than a magnitude of the build up voltage.